SEMICON, Hard Disk and Electronics manufacturing
What we do.....
Our wide variety of high-speed camera, optics and lighting options are the best solution for
- Wire-bonding process - check wire loop pattern, lead frame bounding, early detection of wire necking, etc
- DIE Pick and Place - analysing DIE cracking, precision positioning of nozzle;
- SMT Pick and place - how chip is missing during placing, force applied during placing;
- Eutectic bonding process;
- SMT chip packaging on carrier process
