https://www.hitech.com.sg/application-semiconductor
With highspeed camera, engineer can investigate the amount of pressure and time the nozzle exerts on DIE; qualntity of epozy fillet is analysed.
Highspeed camera check positioning of the very high speed process of miniature gold plated part attachment onto PCB; quality of bonding is assured.
Wire Bond capillary touches neighbouring wire bond. Problem is detected with highspeed camera
Very high speed SMT pick process is checked with highspeed camera
During wire bonding, capillary head touches neighbouring wire bond. Early detection of this problem prevents part from continuing down the production line chain.
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